DESIGN OF EXPERIMENT (DOE) LIQUID PHOTOIMAGEABLE SOLDER MASKS PCB PADA TEACHING FACTORY MANUFACTURING OF ELECTRONICS (TFME) POLITEKNIK NEGERI BATAM
This paper examines several variables to formulated the best parameters in the PCB manufacturing process. This study was implements a PCB with a screen printing process that uses the LPISM (Liquid Photoimageable Solder Mask) application. Where in the process PCB coating is done by connecting the amount of solder liquid mask in one coating using the right parameters using the Design of Experiment (DoE) method. This DoE method improves the quality of the PCB at the lowest possible cost. DoE on LPISM applied at the Teaching Factory Manufaktur Elektronika Politeknik Negeri Batam with the aim of protecting the PCB lines from being connected to one another, providing the right measurements, and using the use of laminated mask solder. Thus, Politeknik Negeri Batam Teaching Factory laboratory assistants can produce PCBs using the LPISM method with quality according to standards. From the analysis, obtained an appropriate angle for screen printing is between 150-200 so that the screen is not damaged. In addition, the oven process can thin the solder mask up to 70-80%. In accordance with the results of comprehensive testing, the 24th data obtained can be recommended because it fulfill the IPC-SM-840C standard, with the 2.5 μm solder mask thickness.
Zhai-min, Wang; Jiang, Cheng; Xiu-fang, Wen; Pi-hui, Pi; Zhuo-ru, Yang, “Research Progress of Liquid UV Photo-imageable Ink for Printed Circuit Board,” Research Institute of Chemical Engineering, South China University of Technology, Guangzhou, Mar. 2004.
Liang, Zhou; Jiang, Chen; Zhuoru, Yang, “Progress in Research on Liquid Photo Imageable Etching Resist Ink,” Research Institute of Chemical Engineering, South China University of Technology, Guangzhou, Jul. 2002.
Yanagawa, Makoto; Santo, Shinji, “Photopolymerizable Liquid Photoimageable Solder Mask,” US5100767A.
Chihara, Machio; Funahashi, Mitsukazu, “Alkaline Developable Liquid Photoimageable Solder Resist Ink Composition,” US4933259A.
Gopal, Sekharan; Mohd Rohani, Jafri; Mohd Yusof, Sha’ri; Abu Bakar, Zailis, “Optimization of Solder Paste Printing Parameters Using Design of Experiments (DOE),” Jurnal Teknologi (Sciences and Engineering) UTM, vol. 43, Dec. 2005.
Pan, Jianbiao; Tonkay, Gregory L.; Quintero, Alejandro, “Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates,” Journal of Electronics Manufacturing, vol. 09, no. 03, pp. 203–213, 1999.
Coates Circuit Products, “Liquid Photoimageable Solder Mask.” [Online]. Available: https://www.coates.de/ccp/connections/liquid.pdf.
The Institute for Interconnecting and Packaging Electronic Circuits, “IPC-SM-840C, Qualification and Performance of Permanent Solder Mask.” Jan-1996.
The Institute for Interconnecting and Packaging Electronic Circuits, “IPC-SM-840D, Qualification and Performance of Permanent Solder Mask.” Apr-2007.
B. Budiana, E. Aprilia, M. T. Ginting, and B. Sugandi, “Kajian Waktu Etsa dan Penurunan Massa PCB double Layar,” JURNAL INTEGRASI, vol. 10, no. 2, pp. 86–91, Oct. 2018, doi: 10.30871/ji.v10i2.987.
Onstantic Technology Co.,LTD., “Photoimageable Solder Resist Ink Data Sheeet: R – 500 GAH Series (2 component / liquid photoimageable solder mask).” .