MODIFIKASI MESIN TRIM FORM PADA PROSES PENGEMASAN INTEGRATED CIRCUIT UNTUK PENURUNAN DAMAGED LEAD
Abstract
Integrated circuit (IC) packaging process of Low Profile Quad Flat Package (LQFP) needs trim form machine for trimming the dambar and forming the IC leads before separated from the lead frame. One of the process sequences in trim form machine is offload, placement of IC units in the tray by pick and place module including open and close of turn table movement to adjust space between lead frame columns before transferred to tray. Open and close movement of the turn table impact to damaged lead production defect. Modification intended to misalignment earlier detection so that the machine can stop automatically and decrease production defect by adding two proximity sensor on turn table. Based on the result of this research, the error on turn table could be reduced to 88% with assembly yield achieved 99.985% or increase up to 0.07%.
Downloads
References
H. Geng, “Semiconductor Manufacturing Handbook”, Edisi Kedua, Mc Graw Hill Education, California, 2018.
Q. Qian., Yong Liu, Yumin Liu, H. Yang, Scott Irving., “TO220 Package Lead frame Optimization for Reducing Trim and Form Delamination by Simulation”, 6th International Conference on Electronic Packaging Technology, Shenzhen, China, 2005.
Yong L., S. Irving, M. Rioux,, “Delamination Modeling for IC Package with Multiple Initial Cracks”, 53rd Electronic Components and Technology Conference, Lousiana, USA, 2003.
A. R. Uy , M.V. Picardal, P. Enriquez, A.C. Alaraz, Package Crack Resolution Through Low Stress Dambar Punch Design: A Six Sigma DMAIC Approach, 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), Melaka, Malaysia, 2010.
T.S. Kiong, I. Ruzaini, Kesvakumar, F.C.Seng, Package Warpage Challenges for LQFP 144 Lead CMOS 90 Device and it's Impact to Lead Coplanarity, 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), Melaka, Malaysia 2010.
