Evaluasi Kualitas pada PCB Hasil Proses Immersion Tin
Abstrak
Proses manufaktur PCB melibatkan banyak proses salah satunya yaitu Surface finishes. Salah satu jenis Surface finishes yang biasa digunakan yaitu Immersion tin. Immersion tin adalah salah satu proses Surface finishes yang menggunakan timah murni pada prosesnya. Immersion tin berfungsi melindungi tembaga dari oksidasi dan membuat permukaan tembaga atau pad mudah disolder. Kebersihan pad dan ketebalan hasil Immersion tin mempengaruhi kualitas PCB yang dihasilkan. Oleh karena itu peneliti melakukan evaluasi kualitas hasil proses Immersion tin dengan menggunakan metode DOE (Design of Experiment). Dimana metode ini dapat membantu dalam menentukan parameter yang optimal. Untuk Variabel yang digunakan yaitu Storage Time After Microetch dan Immersion in tin Bath. Dalam proses penelitian didapatkan PCB mengalami perubahan morfologi pada 23 jam setelah disimpan di storage. Hal tersebut disebabkan oleh adanya kelembapan yang masih terdapat pada PCB akibat dari kurang maksimal pada saat proses pengeringan (drying). Pada penelitian ini Solder Coating Thickness yang optimal pada sampel ke-14 dengan hasil sebesar 4.59 µm dan dengan parameter Storage Time After Microetch selama 50 menit dan Immersion in tin Bath selama 120 menit. Untuk kebersihan pad yang paling optimal terdapat pada sampel ke-5 dan ke-12 dengan parameter Storage Time After Microetch selama 30 menit dan 60 menit dan ditandai dengan tidak adanya kontaminan pada pad tersebut. Selain itu juga, Pada penelitian ini terdapat hasil mapping yang kurang optimal ditandai dengan hanya terdapat 1 bagian dari 1 sampel yang terkandung timah dari 16 sampel pengujian. Sampel tersebut yaitu sampel ke-3 dengan parameter Storage Time After Microetch selama 10 menit dan Immersion in tin Bath selama 55 menit dengan kandungan tin yaitu 91.9 %.
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