Evaluasi Kualitas pada PCB Hasil Proses Immersion Tin
Abstract
The PCB manufacturing process involves many processes, one of which is Surface finishes. One type of Surface finishes commonly used is Immersion tin. Immersion tin is a Surface finishes process that uses pure tin in the process. Immersion tin protects the copper from oxidation and makes the copper surface or pad easy to solder. The cleanliness of the pad and the thickness of the Immersion tin affect the quality of the PCB produced. Therefore, the researchers evaluated the quality of the results of the Immersion tin process using the DOE (Design of Experiment) method. Where this method can help in determining the optimal parameters. The variables used are Storage Time After Microetch and Immersion in tin Bath. In the research process it was found that PCBs underwent morphological changes at 23 hours after being stored in storage. This is caused by the presence of moisture that is still present on the PCB as a result of not being optimal during the drying process. In this study, the optimal Solder Coating Thickness in the 14th sample was 4.59 µm and with the parameters Storage Time After Microetch for 50 minutes and Immersion in tin Bath for 120 minutes. For the most optimal pad cleanliness found in the 5th and 12th samples with the Storage Time After Microetch parameter for 30 minutes and 60 minutes and marked by the absence of contaminants on the pad. In addition, in this study there were less than optimal mapping results marked by only 1 part of 1 sample containing tin from 16 test samples. The sample is the 3rd sample with the parameter Storage Time After Microetch for 10 minutes and Immersion in tin Bath for 55 minutes with a tin content of 91.9%.
Downloads
References
C. F. C. Jr. and H. T. Holden, Printed Circuits Handbook. McGraw-Hill Education, 2016. Accessed: Jun. 23, 2023. [Online]. Available: https://www.accessengineeringlibrary.com/content/book/9780071833950
L. M. C. Sagis, “Determination of Mechanical Properties of Microcapsules,” Microencapsulation and Microspheres for Food Applications, pp. 195–205, Jan. 2015, doi: 10.1016/B978-0-12-800350-3.00010-8.
“Printed Circuit Board Surface Finishes - Advantages and Disadvantages.” https://www.epectec.com/articles/pcb-surface-finish-advantages-and-disadvantages.html (accessed Jun. 23, 2023).
A. Jankovic, G. Chaudhary, and F. Goia, “Designing the design of experiments (DOE) – An investigation on the influence of different factorial designs on the characterization of complex systems,” Energy Build, vol. 250, p. 111298, Nov. 2021, doi: 10.1016/J.ENBUILD.2021.111298.
IPC, “Specification for Immersion Tin Plating for Printed Circuit Boards.” IPC , 2013.
J. Antony, E. Viles, A. F. Torres, T. I. de Paula, M. M. Fernandes, and E. A. Cudney, “Design of experiments in the service industry: a critical literature review and future research directions,” TQM Journal, vol. 32, no. 6, pp. 1159–1175, Nov. 2020, doi: 10.1108/TQM-02-2020-0026.
A. Permana, H. H. Purba, and S. Hasibuan, “Design of Experiment (DOE) Analysis with Response Surface Method (RSM) to Optimize the Electroplating Parameter,” ComTech: Computer, Mathematics and Engineering Applications, vol. 12, no. 2, pp. 99–109, Nov. 2021, doi: 10.21512/COMTECH.V12I2.6998.
A. Jankovic, G. Chaudhary, and F. Goia, “Designing the design of experiments (DOE) – An investigation on the influence of different factorial designs on the characterization of complex systems,” Energy Build, vol. 250, p. 111298, Nov. 2021, doi: 10.1016/J.ENBUILD.2021.111298.
“Sample Statistics and their Distributions,” pp. 245–283, Sep. 2015, doi: 10.1002/9781118799635.CH6.
D. C. Montgomery, Simple Comparative Experiments, 9th ed. John wiley & sons, 2017.
B. Durakovic, “Design of experiments application, concepts, examples: State of the art,” Periodicals of Engineering and Natural Sciences, vol. 5, no. 3, pp. 421–439, Dec. 2017, doi: 10.21533/PEN.V5I3.145.
A. Arazna, A. Krolikowski, G. Koziol, and J. Bielinski, “The corrosion characteristics and solderability of immersion tin coatings on copper,” Materials and Corrosion, vol. 64, no. 10, pp. 914–925, Oct. 2013, doi: 10.1002/MACO.201106434.
M. A. R. Adawiyah, O. S. Azlina, N. A. Fadil, S. R. Aisha, and M. A. A. Hanim, “Electroless and Immersion Plating Process towards Structures and IMC Formation,” International Journal of Engineering and Technology, vol. 8, no. 6, pp. 2558–2570, Dec. 2016, doi: 10.21817/IJET/2016/V8I6/160806210.
IPC, “Qualification and Performance Specification for Rigid Printed Boards,” IPC-6012D. IPC, 2015.
IPC-2221/2222 Task Group, “IPC-2222A Sectional Design Standard for Rigid Organic Printed Boards,” Bannockburn, illinois , Dec. 2010.
IPC, “IPC-A-600J (Acceptability of Printed Boards),” pp. 1–180, Apr. 2010.
IPC, “Printed Board Handling and Storage Guidelines, IPC-1601A.” 2016.
IPC, “Generic Standard on Printed Board Design (IPC-2221 - Revision B - Standard Only),” IPC. 2013.
IPC, “Acceptability of Printed Boards (IPC-A-600 Revision K),” IPC. IPC, 2020.
IPC, “Printed Board Handling and Storage Guidelines (IPC-1601A),” IPC. IPC, 2016.
Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License (Attribution-ShareAlike 4.0 International (CC BY-SA 4.0) ) that allows others to share the work with an acknowledgment of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgment of its initial publication in this journal.
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).
Open Access Policy
This journal provides immediate open access to its content on the principle that making research freely available to the public supports a greater global exchange of knowledge.
Its free availability on the public internet, permitting any users to read, download, copy, distribute, print, search, or link to the full texts of these articles, crawl them for indexing, pass them as data to software, or use them for any other lawful purpose, without financial, legal, or technical barriers other than those inseparable from gaining access to the internet itself.
