Optimization of Pick and Place Variable to Increase Output from Die Attach Process on RFID Chip Fabrication

  • Daniel Aturman Sinaga Politeknik Negeri Batam
  • Aditya Gautama Darmoyono Politeknik Negeri Batam
  • Dwi Imam Mulyono Politeknik Negeri Batam
DOI: https://doi.org/10.30871/jaee.v5i1.3036

Abstract

Pengaplikasian teknologi dapat mempermudah manusia dalam kehidupan sehari-hari. Salah satu tekonologi ini adalah RFID. Pada pembuatan chip RFID, timbul masalah pada proses pick and place yaitu terdapat beberapa variabel  set up mesin yang kurang optimal,  kendala tersebut membuat mesin kurang  efisien dalam waktu dan kualitas, sehingga dilakukan optimalisasi variabel-variabel tersebut. Proses optimalisasi pada penelitian ini tidak hanya mempertimbangkan cycle time yang minimum tetapi juga kualitas produk yang dihasilkan. Oleh karena itu pada tahap awal percobaan dicari selang nilai dari variabel-variabel yang akan dioptimalisasi. Pada selang ini produk yang dihasilkan masih masuk ke dalam spesifikasi kualitas yang telah ditentukan. Langkah selanjutnya adalah proses optimalisasi cycle time menggunakan Design of Experiment dengan metode RSM. Tujuannya meminimalisasikan cycle time sehingga produk dapat lebih banyak diproduksi tanpa mengorbankan kualitas. Hasil dari metoda ini adalah cycle time selama 3.188 detik dari yang sebelumnya 4.9 detik. Diketahui  pada satu leadframe terdapat 36 chip. Sehingga total waktu pick and place menurun menjadi 1.91 menit per leadframe (3.188x 36). Untuk perhitungan waktu die attach ditambah pick and place per leadframe adalah = 1.91 menit + 1.30 menit (epoxy application) + 1 menit (handling) + 0.35 menit (inspection) = 4.56 menit. Dari hasil perhitungan ini akan diperoleh UPH 13 leadframe, meningkat sebanyak 2 leadframe dari sebelumnya.

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Published
2021-06-30
How to Cite
Sinaga, D., Darmoyono, A., & Mulyono, D. (2021). Optimization of Pick and Place Variable to Increase Output from Die Attach Process on RFID Chip Fabrication. Journal of Applied Electrical Engineering, 5(1), 9-12. https://doi.org/10.30871/jaee.v5i1.3036
Issue
Vol 5 No 1 (2021): JAEE, June 2021
Section
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