OCTOWINANDI, Vivin; RISANDRIYA, Sumantri K.; ASAAD, Nur Sakinah; DIPUTRA, Muhammad Naufal Airlangga; RIA, Riki; PRATAMA, Adjie Sukma; WIVANIUS, Nadhrah. Pengukuran Kemampuan Manufaktur PCB Empat Layer di TFME. Journal of Applied Electrical Engineering, [S. l.], v. 8, n. 1, p. 17–23, 2024. DOI: 10.30871/jaee.v8i1.6991. Disponível em: https://jurnal.polibatam.ac.id/index.php/JAEE/article/view/6991. Acesso em: 23 feb. 2025.