Penggunaan SEM dan Image-J dalam Mempelajari Ketebalan Lapisan Mikrostruktur

  • Muhammad Iqbal Politeknik Negeri Batam
  • Muhammad Firdaus Politeknik Negeri Batam
  • Muhammad Al Fauzan Politeknik Negeri Batam
  • Meilan Novayanti Politeknik Negeri Batam
  • Fathiyyah Syahidah Sujana Politeknik Negeri Batam
  • M. Rifan Maulana Politeknik Negeri Batam
  • Hana Mutialif Maulidiah Politeknik Negeri Batam
  • Widya Rika Puspita Rika Puspita Politeknik Negeri Batam
  • Mustanir Mustanir Politeknik Negeri Batam
  • Adlian Jefiza Politeknik Negeri Batam
  • Budiana Budiana Politeknik Negeri Batam
  • Nur Sakinah Asaad Politeknik Negeri Batam
DOI: https://doi.org/10.30871/jaee.v5i2.3746

Abstract

Telah dilakukan penelitian terkait dengan ketebalan lapisan mikrostruktur dengan menggunakan SEM (Scanning Electron Microscope) dan Image-J. Sampel diuji dengan menggunakan SEM untuk mendapatkan mikrostruktur dari sampel. Setelah mikrostruktur didapatkan maka dilakukan analisa ketebalan lapisan mikrostruktur dengan menggunakan teknik pengukuran secara langsung menggunakan SEM dan teknik pengukuran tidak langsung menggunakan aplikasi Image-J. Berdasarkan hasil penelitian yang telah dilakukan, pengukuran ketebalan lapisan dengan menggunakan SEM dan Image-J menunjukkan pola kurva yang sama untuk semua ketebalan lapisan. Persentase perbedaan pengukuran ketebalan lapisan dengan menggunakan SEM dan Image J adalah 0.7% untuk lapisan ke-1, 1,6 % untuk lapisan ke-2 dan 0.8 % untuk lapisan ke-3. Persentase perbedaan  tersebut sangat kecil (<2%) sehingga aplikasi Image-J ini dapat digunakan sebagai alternatif di dalam pengukuran ketebalan lapisan mikrostruktur

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Published
2021-12-30
How to Cite
Iqbal, M., Firdaus, M., Fauzan, M., Novayanti, M., Sujana, F., Maulana, M., Maulidiah, H., Puspita, W. R. P., Mustanir, M., Jefiza, A., Budiana, B., & Asaad, N. (2021). Penggunaan SEM dan Image-J dalam Mempelajari Ketebalan Lapisan Mikrostruktur. Journal of Applied Electrical Engineering, 5(2), 69-74. https://doi.org/10.30871/jaee.v5i2.3746
Issue
Vol 5 No 2 (2021): JAEE, December 2021
Section
Manuscripts

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